asteroza + micron   8

Hybrid Memory Cube Consortium - Home
Micron is licensing IBM 3D wafer tech to make these 3D RAM chips, the eventual goal being to best Package-on-Package (PoP) SoC technology for density/energy efficiency/data throughput.
HMC  hybrid  memory  cube  consortium  3D  semiconductor  chip  manufacturing  process  materials  science  research  technology  IBM  Micron  Delicious 
december 2011 by asteroza

Copy this bookmark:



description:


tags: